TEX-21BG
TEX-218G
Wafers require careful handling to ensure narrow die streets and prevent edge chipping after dicing.
The TEX-21 Series Die Matrix Expanders evenly expand/separate wafers in the X and Y directions so that die streets cross all chips.
This eliminates waste and facilitates chip pickup to make mounting in die-bonding processes more efficient and problem-free.
After expansion, grip rings that pinch the outer ring and inner ring help keep separated wafers on the tape in the expanded state.
| Model | Wafer size | Dimensions |
|---|---|---|
| TEX-21BG | up to 6 inch | 340mm(W) x 600mm(D) x 350mm(H) |
| TEX-218G | up to 8 inch | 400mm(W) x 690mm(D) x 350mm(H) |
| 1 | Expansion ratio can be varied as necessary. |
| 2 | Expansion speed can be varied. |
| 3 | The heated expansion stage contributes to high-ratio expansion. |
| 4 | The expanded film and wafers can be gripped automatically. |
