Development and sales of semiconductor manufacturing systems in Japan

Wafer Expander TEX-21series

  • TEX-21BG

    TEX-21BG

  • TEX-218G

    TEX-218G

Wafers require careful handling to ensure narrow die streets and prevent edge chipping after dicing.


The TEX-21 Series Die Matrix Expanders evenly expand/separate wafers in the X and Y directions so that die streets cross all chips.


This eliminates waste and facilitates chip pickup to make mounting in die-bonding processes more efficient and problem-free.


After expansion, grip rings that pinch the outer ring and inner ring help keep separated wafers on the tape in the expanded state.

Specifications


Model Wafer size Dimensions
TEX-21BG up to 6 inch 340mm(W) x 600mm(D) x 350mm(H)
TEX-218G up to 6 inch 400mm(W) x 690mm(D) x 350mm(H)

Features


1 Expansion ratio can be varied as necessary.
2 Expansion speed can be varied.
3 The heated expansion stage contributes to high-ratio expansion.
4 The expanded film and wafers can be gripped automatically.
Before→After

Operation movie



[Wafer Expander TEX-218G]

Products

Wet Cleaning System

Cassette Cleaning System

  TCC-803 -Domestic Only-

Photomask Cleaning System

  TWE-200

  TW-300

  TW-700

  TW-1000 -Domestic Only-

  TWC-302 -Domestic Only-

Fully Automatic Photomask Cleaning System -Domestic Only-

  TWC-200A -Domestic Only-

  TWC-304A -Domestic Only-

Simple Cleaning Units
-Domestic Only-

  Chemical unit -Domestic Only-

  Scrub unit -Domestic Only-

  Dry unit -Domestic Only-

Cleaning Chemicals

Super Clean Heaters -Domestic Only-

for DI water
-Domestic Only-

  QH series

for Inert Gas/Clean Dry Air
-Domestic Only-

  SH series

Simple temperature controller
-Domestic Only-

  TC-2030

UV Ozone Cleaner

Wafer Mounter

Manual Wafer Mounter

  FM-224 series

Semi-Automatic Wafer Mounter

  FM-3343

  FM-903S

  FM-664 series

Wafer Expander

Grip Ring

UV Curing System

UV-LED type

  UVC-200/300

  UVC-200A/300A
-Domestic Only-

  UVC-708

High-Pressure Hg Lamp type

  UVC-408

  UVC-512