Development and sales of semiconductor manufacturing systems in Japan

Manual Wafer Mounter FM-224 series

  • Manual Wafer Mounter FM-224 series
  • Manual Wafer Mounter FM-224 series

Select from a wide range of manual wafer mounter models to meet needs ranging from research and development to semi-custom production.

This manual wafer mounter series accommodates three workpiece sizes: 300 mm, 200 mm, and 150 mm.

These manual wafer mounter models can be manufactured for either dicing film mounting or back grind film mounting.


The products in this series of manual wafer mounters can be applied not only to wafers but also to packaging, glass, ceramic, and various other types of workpieces. They can also be customized to meet a wide range of user specifications.

Specifications


< for Dicing process model >

Model Wafer/Frame size Dimensions
FM-2243 up to 12 inch 510mm(W) x 860mm(D) x 330mm(H)
FM-2248 up to 8 inch 455mm(W) x 780mm(D) x 300mm(H)
FM-2246 up to 6 inch 375mm(W) x 760mm(D) x 230mm(H)

< for Back Grind model >

Model Wafer size Dimensions
FM-2243-BG up to 12 inch 510mm(W) x 860mm(D) x 330mm(H)
FM-2248-BG up to 8 inch 455mm(W) x 780mm(D) x 300mm(H)
FM-2246-BG up to 6 inch 375mm(W) x 760mm(D) x 230mm(H)

Features


1 Instantaneous bubble-free mounting
2 Built-in automatic balancing mechanism for mounting roller
3 Built-in circular cutter
4 Built-in horizontal cutter
5 Built-in separator winding mechanism
6 Customization available

Optional item



Chuck table heater

Uses


< for Dicing process >

FM-224 series


< for Back Grind process >

FM-224-BG series


< others >

Customization is available for other usage e.g. DAF process, DFR prcess etc.

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