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TechnovisionTOP > News & Topics
News & Topics

Oct. 2018

【Grip ring case released】

Technovision, Inc. has released the Grip ring case to store single Grip Ring or Dicing frame.
Ideal for shipping or storage applications.

 Non-contact to the wafer/chip
 Stackable design for small storage space
 Material: conductive PP

Model Grip Ring/
Dicing frame
GRC-04 GR-4
GRC-05 GR-5
GRC-06 GR-6
GRC-08 GR-8
GRFC-05 GR-5/DTF2-6-1
GRFC-08 GR-8/DTF2-8-1

Jul. 2018

【Technovision Summer holiday notice】

Please be informed that we will be closing from Aug 11 to 19 due to Summer holiday.

We will resume working from Aug 20.

Apr. 2014

【Announcement of the new President】

Technovision Inc. is pleased to announce the appointment of Takahira was president
as chairman, and Hiroyuki Hayami appointed as Representative Director on April 1, 2014.

Ashito Takahira : Chairman

Hiroyuki Hayami : Representative Director

Jun. 2013

【"Improved yield and quality in the cleaning of the photomask"
- Simple photomask cleaning system support up to 14 inch mask will be released soon -】

"TWC-302" simple mask cleaning system support up to 14 inches will be released soon.

"TWC-302" have two tanks for mask cleaning equipment, mask is a brush-scrubbed and rinsed in the first tank for removing particles adhered to the mask.

In the second tank, the process is hot DIW drying. Simple and superior quality drying system are provided.

Cleaning with chemical solution is provided as an option in the scrubbing of the first tank, it is possible to clean the resist residue.

TWC-302 Simple Mak Cleaning System

※Simple mask cleaning equipment for 7 inches "TWC-202" is also currently in development.

TEL : +81-49-299-1385
FAX : +81-49-299-1386
E-mail :
Addrs : 2078 Nakayama Kawajima-machi,
Saitama 350-0165, Japan

Jun. 2013

【Industry's first!(*) "Realize the zero extension in the Die Matrix Expander"
- Low-expansion Die Matrix Expander LEX-218 release -】

Technovision will be released low expansion Die Matrix Expander "LEX-218" used after the dicing of the semiconductor wafer.

Low-expansion Die-Matrix Expander
[Photo:Low-expansion Die-Matrix Expander: LEX-218]

Recently, the performance of the device to pick up the chips of the wafer after dicing has been improved. Dicing street(the width of each chip-to-chip) width is even slightly, it is coming enabled to pick up the chip.

As a result, the wafer after dicing are also able to be picked up extended less than before.

On the other hand, in order to cut out the chip as many as possible from the one wafer, chips are put to the edge of wafer.

However, the chip is too close to the edge of the wafer during expansion, there is a problem even in the pickup device performance was improved, and you can not handle well at the time of pick-up, defects occur more.

Technovision have developed a new die matrix expander of low-expansion support to the expansion stroke of 15mm or less, though the normal expander is difficult to stroke 15mm or less.

This LEX system is fitted to grip rings automatically for holding the expanded state without human intervention after expansion of the wafer.

The low-expansion wafer expander also support the expansion stroke 0mm only fitting to grip rings. It's industry's first in our survey.

Adjustment of the height of the expansion stroke is a possible to set a three step preset within the scope of the 10mm. Height adjustment is no longer required.
(*)Our research(June, 2013)

TEL : +81-49-299-1385
FAX : +81-49-299-1386
E-mail :
Addrs : 2078 Nakayama Kawajima-machi,
Saitama 350-0165, Japan

May 2013

【"Face Down Die Matrix Expander" Coming soon
- Most suitable for the MEMS wafer after the stealth dicing -】

Technovision Inc. will be released the latest upside-down type die matrix expander the Face-down die matrix expander", using wafer split/expansion after the dicing of the semiconductor wafer.

MEMS device is using stealth dicing which does not use water in the process of dicing.
In the die separation process, Si debris generated from the chip edges, and the debris adhere to the fragile structure or fall onto the tape. It has led to a yield reduction.

"Face Down Die Matrix Expander" is a device to prevent adhesion to the structure of the Si debris generated, it is dropped down the Si debris is inverted upside down wafer expansion mechanism.

・Wafer splitting/expansion to the stealth dicing of MEMS devices
・Si debris adhesion prevention
・Easy operation

※Leaflet 「Face Down Expander」

We accepted to inquire about details at any time,
please feel free to ask us.

TEL : +81-49-299-1385
FAX : +81-49-299-1386
E-mail :
Addrs : 2078 Nakayama Kawajima-machi,
Saitama 350-0165, Japan

Dec. 2012

【Winter holidays】

We are sorry that we will be closed from December 29th, 2012 to January 6th, 2013 for Winter holidays.

Thank you for your understanding and support in advance.

Oct. 2012

【Participate in "China SSL 2012" at Guangzhou in China】


Technovision will participate in the "China SSL 2012" at Guangzhou in China from November 5 to 7 in 2012.

Technical presentation, , "Quality up in photolithography process through Photo mask Cleaning", will be held on Wednesday, November 7.

Presentation abstract (60KB)  abstract


Official site : China SSL 2012

Aug. 2012

【UV Curing system article has been published in the Nikkei (August 9, 2012)】

The Nikkei of August 9, 2012, UV(ultraviolet) exposure device / UV curing equipment article has been published in a post-processing stage in semiconductor manufacturing.

It mention reduce operational costs, reduction in power use and the realization of a long life by adopting a LED light source.

Aug. 2012


Our office will be closed

from August 11(Sat) until August 19(Sun) in 2012

for Company holidays.

Please contact us via e-mail or fax during the period,
and we will get back to you from August 20(Mon).

Jul. 2012

【SEMICON TAIWAN 2012: The first exhibited abroad! Fully automatic LED UV curing system】

Technovision is participating in SEMICON TAIWAN 2012 in Sep. 2012.

Fully automatic UV curing system by LED light source of next-generation technologies
achieving power saving and long life is going to be exhibited cooperated with sales distributor
in overseas trade show firstly was decided.

In order to respond the performance and response, we are going to participate
in Semicon Taiwan 2012 from Sep.5th to Sep.7th(URL:
as far as we have to send messages abroad.

Please see the detail >> exhibition info.

May. 2012

【Coming soon "TWC-300A" fully automatic mask cleaning system support up to 14 inches】

TWC-300A fully automatic mask cleaning system supports up to 14 inches mask will be released soon.

"TWC-200A" support up to 7 inches has been developed and provided to many customers,
and we had received many requirements from other customers about supporting over than 9 inches.

This time, we have announced to provide the latest fully automatic mask cleaning system support up to 14 inches.

1: It doesn't use any dangerous hot sulfuric acid, sulfuric acid-hydrogen peroxide and organic solvent.
2:Eco-friendly alkaline water-soluble chemicals has been developed with chemical manufacturers.
3: Complete removal of Resist and Resist residue.
4:To provide hardware(equipment) and software(cleaning know-how and recipes)
5:Complete removal of particles larger than 1 μm

Apr. 2012

【Green Lighting Shanghai 2012】

Green Lighting Shanghai 2012 is one of the leading and truly international trade events
featuring the most advanced environmental friendly manufacturing equipment,
materials and applications in the world's growing lighting industry market, China.

Technovision is going to present some technical documents for Photomask cleaning system as follows.

abstract technical paper presentation
Abstract  abstract
Technical Paper  technical paper
Presentation  presentation

・Exhibition official site : 「Green Lighting Shanghai 2012

【Green Lighting Shanghai 2012】

  • Exhibition : Green Lighting Shanghai 2012
  • Holding period :April 25 - 27, 2012
  • Venue : Shanghai World Expo Exhibition & Convention Center
  • Exhibition booth : Japan-room
  • Exhibition article : Photomask cleaning system

  • Mar.2012

    【Started the development of 12 inches Die Matrix Expander】

    Technovision, Inc. has been started to develop Die Matrix Expander for 12 inches(300mm) .

    Die Matrix Expanders evenly expands wafers in the X and Y directions so that streets cross all chips.

    We had many requirements and some questions about supporting 12 inches Die Matrix Expander from many customers. This time, preparation will be completed and development will be started.

    In addition, according to the development of 12 inches Die Matrix Expander, we will provide grip ring of double-ring structure we recommended.

    If you have any questions, please feel free to contact us.

    >> Inquiry form

    July 2007

    【The Model FM-664 series】

    The Model FM-664 series
    The All-purpose Semi-automatic Film Mounter, which can also be utilized for Pre-cut film, was recently introduced into the market.

    The Background of Development
    Due to the increase in recent diversified film/tape technology used in the dicing process, we have made great efforts and met the demands for a new product, capable of handling laminations for all kinds of films.

    The Outline of the Product
    This product is an unprecedented film mounter, capable of laminating pre-cut film as well as all kinds of films used in the film laminations. Operators only need to load and unload work-pieces.

    Main Features
    1. Lamination for Pre-cut film in Dicing process
    2. Lamination for Two-layered film (DAF with Dicing film)
    3. Lamination for single DAF film-rolled
    4. Lamination for film-rolled in Dicing process
    5. Lamination for BG film/Front-protection film
    6. Available for UV curing film and blue film
    7. Supporting wafers up to 200mm/8"

    Aug. 2005


    Our office will be closed
    from August 10(Wed) until August 16(Tue), 2005
    for Company holidays.
    Please contact us via e-mail or fax during the period, and we will get back to you from August 17(Wed).

    Feb. 2005

    【The clean room is ready!】

    Since we moved office in August, we had been working on preparing clean room, so that we may provide our customers with higher-quality service.
    The clean room is now completed, and we will be using them actively for system demonstrations, testing, and product development.

    ♥ We’d like to take this opportunity to thank everyone who participated in last month’s ICP (IC Packaging) Technology Expo. We feel that it was a greater success than we had ever anticipated!

    Dec. 2004

    【NEW! Model FX-300: Semi-automatic wafer mounter for 300mm/12" wafers】

    We've delivered the first unit, and will be exhibiting display panels at SEMICON JAPAN 2004.
    This model is suited for a variety of uses, from DAF lamination critical to high-density packaging, to dicing processes and protection film lamination.

    For more details, come visit us at our SEMICON JAPAN booth!

    Oct. 2004

    【UV curing system, Model UVC-512】

    We are currently developing a new UV curing system, Model UVC-512, for exhibition at SEMICON JAPAN 2004.
    UVC-512 is a semi-automatic system that supports 300mm/12" wafers. Like the existing 200mm/8" wafer systems (Model UVC-108 and Model UVC-408), it features a compact and lightweight design with a small footprint. It’s definitely something you can look forward to!

    Sep. 2004

    【Ultra Pure DI Water Heaters /Clean Dry Air Heaters】

    Steady shipment continues for our products which are designed for installation into existing systems and lines:

    QH series: Ultra Pure DI Water Heaters
    SH series: Clean Dry Air Heaters

    This implies that cleaning system manufacturers are doing well, and is a clear indication that, not only the system manufacturers, but the semiconductor/FPD industry as a whole is making an economic turnaround. As a member of the community, we are joyful of this, and hope to witness further growth in the coming years.

    ♣To request a catalog or inquire about our heater products, please go to the Contacts page.

    Aug. 2004

    【We have settled in at our new office.】

    We have settled in at our new office.
    In sync with the turnover of the Japanese economy, Technovision will be starting anew at our new locations, to make greater contributions to our customers and to the society.
    We’ll be aiming for a more prompt correspondence and delivery ahead of the schedule.
    Please don’t hesitate to let us know if there’s anything we can do better!

    July 2004

    【Office Relocation 】

    Starting August 1, 2004, Technovision,Inc. will be running its operations at two separate locations (the headquarters and the fab) for business expansion and improved management efficiency. Please see below for the new contact details.

    We apologize for any inconvenience this may cause, and hope to serve you with greater commitment from our new locations.

    New Address:45-2 Kujiraishinden, Kawagoe city,Saitama 350-0809, Japan
    TEL: 81-(0)49-232-0072 (No change)
    FAX: 81-(0)49-232-2922 (No change)

    Plant: 2078 Nakayama, Kawashima-cho,Hiki-gun, Saitama 350-0165, Japan
    TEL: 81-(0)49-299-1385

    June 2004

    【Model FX-300】

    We have received an order from a leading foundry company for our 300mm/12" semi-automatic wafer mounter, Model FX-300.
    FX-300 was co-developed with a leading film manufacturer, and is designed for die attach / die bonding film lamination. It is also designed for use with special films that have both DAF and dicing functionalities.

    Needless to say, it can also be used as a single-purpose system for lamination of dicing films or protection films.

    May 2004

    【We now have our new cassette cleaner system】

    We now have our new cassette cleaner system, Model TCC-801, installed and available for demonstration.
    TCC-801 was designed for precision cleaning of wafer cassettes, carriers, and boxes used with high-end devices. It features various cleaning technologies and functions unseen in our previous products.
    Leaving generic products and container cleaning to manufacturers overseas, we aim to satisfy the needs of customers in the high-end, high-value added, and high-mix low-volume production fields.

    Apr. 2004

    【"科技視野有限公司" This is our Chinese corporate name.】

    As we have reported last month, we were pleased to host many visitors at our booth during SEMICON CHINA 2004.
    From the global semiconductor manufacturing plant "China", with technologies from "Japan", Technovision will continue to contribute to the semiconductor industry and to the world.

    Technovision | Semiconductor Manufacturing, Cleaning System, Post-process

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