Google translator translates this web page into the language of your country though layout is a little crumble.
Chinese site is provided.

TechnovisionTOP > Products > UV Ozone Cleaning System
UV Ozone Cleaner
UV Ozone cleaner

The UV(Ultraviolet) -Ozone Cleaner removes molecular organic contaminants from workpiece surfaces and can also be used for surface modification via UV emitted at wavelength of 184.9nm and 253.7nm.

Surface treatment technology based on UV light is a dry cleaning which requires no vacuum system and can achieve a reliable cleaning effect without failure, and is further blessed with such a distinguished advantage that delicate workpiece surface suffer no damage. UV Ozone cleaner is also effective for pre-cleaning and post-cleaning / final cleaning in wet processes.

This simple system for dry cleaning requires no complicated structure and is the best used in final cleaning.


■UV Ozone Cleaning Mechanism


UV Cleaning Mechanism

  
UV Ozone Cleaning Mechanism
Ozone generation
Ozone is generated by oxygen in the atmosphere which absorbs the ultraviolet rays of 184.9nm.
Ozonolysis
Generated-ozone generate oxygen and atomic oxygen to absorb the ultraviolet rays of 253.7nm furthermore.
Decomposition of
organic matter
Highly unstable active oxygen tied to organic compound and do oxidative decomposition such as H2O, CO2, and NOx.

Features

UV Ozone cleaning systems, UV-208 and UV-312 by Technovision, are simple dry cleaning systems. It is adopted high-density grid shaped low-pressure mercury lamp as the UV light source. It can irradiate uniformly to the entire workpiece area.

  
Features
1
Equipped with a high-density UV serpentine-style grid lamp
2
Uniformly irradiates workpiece surfaces
3
Small and compact design
4
Simple utility
5
Applicable to both double-side and single-side cleaning
6
Simple operation with a safety lock function
UV Ozone Cleaning System

high-density UV grid lamp

■Change of wettability

■Change of contact angle

Change of wettability Change of contact angle
Parameters
Irradiation time: 5 min/Irradiation distance: 10 mm
Tool: UV-208/Sample: Si wafer
Parameters
Irradiation time: 5 min/Irradiation distance: 10 mm
Tool: UV-208/Sample: Si wafer
Uses
  
Uses
1
For cleaning wafers, photomasks, glass substrates, lenses and optical components.
2
Surface modification of resin sections
3
Improved contactabilty, enabling better adherence, coating, printing, deposition, and soldering
4
Improvement of work surface wettability
UV Ozone Cleaning System

*A high-density UV grid lamp and power supply may be purchased separately.

Technovision | Semiconductor Manufacturing, Cleaning System, Post-process

Copyright © 2000-2013 Technovision, Inc. All Rights Reserved.