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FOUP

The FOUP cleaning system is particularly well suited to the precision cleaning of the 300 mm (12") wafer container, FOUP.
The simple, compact structure of this cleaning system has been efficiently designed by utilizing Technovision's proprietary cleaning and drying know-how.


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FOUP Cleaning System
Wash & Rinse
Wash & Rinse

Equipped with a nozzle that washes the five inner and outer surfaces of the FOUP.
Washes with hot pure DI water (40 - 50 C) at high pressure (0.5 MPa).

Dry & ESD
Dry & ESD

Equipped with an air-knife that covers all areas. Ensures perfect drying by means of a two-step dry process. Maintains the temperature in the drying chamber at 80 C or lower.

  
Features
1
Compact with a small footprint
2
Simultaneous washing of FOUP unit and door
3
Washing nozzle positioned and oscillated in two directions to enable precise, even washing of the entire container
4
Powerful jet spray for washing containers up close
5
Independent washing and drying chambers, enabling highly efficient, continuous washing and drying
  
Utilities
DI water
15 - 20 liters/min., 0.1 - 0.15 MPa
CDA
2.3m3/min., 0.45 - 0.50 MPa
Drain
50 A PVC
Exhaust
100 A Exhaust Duct
Power
200 V, 28 KW, 3 phase (other voltages available)
Dimensions
1980 mm (W)×1480 mm (D)×1990 mm (H)
Weight
approx. 900 kg