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Model FM-6648

Model FM-6648

This model was developed for both pre-cut and normal tape.
The industry's first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the following uses

  
Uses
1
For dicing process with both pre-cut and normal tape
2
For dicing process with pre-cut tape only
3
For dicing process with normal tape only
4
For precut two-layered tape (DAF with dicing tape)
5
For normal two-layered tape (DAF with dicing tape)
6
For single DAF tape
7
For back grind (BG) film
8
For front-protection film
9
For rear-protection film
10
For functional film (resist film, CSP film sealings, underfill film, and others)
  
Features
1
User-settable parameters, including application pressure, speed, and temperature
2
Variable application pitch for normal tape
3
Tension-free application
4
Bubble-free application
5
Can be customized for non-contact surface application
6
Equipped with measures against static electricity
7
Compact, light-weight, and small-footprint type
FM-6648

Please contact overseas sales and marketing team for more product information.