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Technovision TOP > Products > Die Matrix Expander > Face Down Die Matrix Expander
Die Matrix Expander
Summary

MEMS device is using stealth dicing which does not use water in the process of dicing.

In the die separation process, Si debris generated from the chip edges, and the debris adhere to the fragile structure or fall onto the tape. It has led to a yield reduction.

"Face Down Die Matrix Expander" is a device to prevent adhesion to the structure of the Si debris generated, it is dropped down the Si debris is inverted upside down wafer expansion mechanism.

Face down expander MEX-200

*For illustrative purposes only:MEX-200(8"/200mm)

In order to prevent debris from adhering to the structure by static electricity generated in the splitting, is equipped with antistatic function.
* Coming soon

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