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Die Matrix Expander
Summary

Wafers require carefully handling to ensure narrow streets and prevent edge chipping after dicing.

The TEX Series of Die Matrix Expanders evenly expands wafers in the X and Y directions
so that streets cross all chips.

This eliminates waste issues and facilities chip pickup in such a way that makes mounting in die-bonding processes smoother.

Features
  
Features
1
Expansion ratio can be varied as necessary.
2
Expansion speed can be varied.
3
The heated expansion stage is helpful for high-ratio expansion.
4
Expanded film and wafers can be gripped automatically.
Wafer expansion

Wafer to be extended uniformly to X-Y direction


Die matrix expander procedures

Describes the procedure of extension of the wafer by images and movies.


Procedure（images） Procedure（video） Procedure（video）
Expansion procedure(TEX-21BG) Expansion procedure（Movie：TEX-218）
Auto Cut Model

■ Achieved "excellent workability"


The latest die matrix expander features automatic cut function.
Separation and detach film operation will change to "just press the switch".

Model TEX-220 is to reduce the operation's work, possible to improve the production efficiency, the latest die matrix expander with auto-cut function.

die matrix expander with auto-cut TEX-220
Model TEX-220
Standard Model