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Technovision TOP > Corporate History
Corporate History

Sep. 1987

Technovision,Inc. was established.

Oct. 1987

Development and market launch of wafer expander TEX-20S.

Dec. 1987

Development and market launch of double sided-mask cleaner TW-30.

May 1988

Development and market launch of new wafer expander TEX-21B and wafer expander TEX-218 for 200mm wafers.

Nov. 1988

Development and market launch of new double-sided mask cleaner TW-30L.

Mar. 1989

Development and market launch of film applicator FM-114.

Feb. 1990

Development and market launch of clean heater for deionized water.

Sep. 1991

Office moved to Sayama City, Saitama, for business expansion purposes.

Oct. 1993

Development and market launch of large-sized mask cleaning equipment TW-700.

Aug. 1994

Development and market launch of fully automatic cleaning equipment for mother glass for optical disc.

Jul. 1996

Obtained certification under Law for Promotion of Small and Medium-Sized Enterprises.

Aug. 1996

Obtained certification under Innovation Support Fund for business plan concerning R&D and other activities.

Nov. 1996

Company headquarters moved to Kawagoe city, Saitama, for business expansion purposes. Introduction of clean rooms and deionized water supply facilities for demonstration purposes.

Aug. 1997

Development and market launch of fully automatic cleaning equipment for wafer cassettes.

Mar. 1998

Development and market launch of super-clean heater for ultra-pure deionized water.

Nov. 1998

Development and market launch of UV film curing equipment for post dicing processes.

Sep. 1999

Development and market launch of UV-ozone cleaning equipment.

Mar. 2000

Development of multifunctional wafer mounters.

Aug. 2000

Development and market launch of wafer mounters for 300mm wafers.

Dec. 2001

Development of FOUP cleaning systems, exhibited at SEMICON JAPAN 2001.

Jan. 2002

Receipt of order from a leading FPD manufacturer for PDP panel photomask cleaning systems.

Jul. 2002

First attendance to SEMICON WEST.

Dec. 2002

Development of table-top UV curing system with high-pressure mercury lamp, the industry’s first.

Aug. 2003

Development of cassette cleaning systems for small-volume lots and R&D.

Nov. 2003

Delivery of FOUP cleaning systems to SEMATECH, Inc.

Jan. 2004

Conclusion of distributorship agreements in Taiwan and China.

Mar. 2004

First attendance to SEMICON China 2004 (Shanghai).

Apr. 2004

Registration of Technovision’s Chinese corporate name with the Chinese government.

Aug. 2004

Office moved for business expansion purposes. Headquarters and fab separated for improved management efficiency.

Jan. 2005

Conclusion of distributorship agreements in Germany, France, and the UK.

Mar. 2005

Clean room constructed at the Fab.

Apr. 2005

First attendance to SEMICON Europa 2005 (Munich, Germany).

Apr. 2006

Added Chinese version of Web pages.

Feb. 2007

Released either directional Grip Rings

Jul. 2007

Releases multi functional wafer mounter (support both pre-cut and normal tape)

Nov. 2008

Releases Back Grind manual Tape Mounter with inner cut function.

Feb. 2009

Released the latest LED light source UV Curing system for dicing process.

May 2011

Developed 18 inches/450mm wafer mounter.

Nov. 2011

Participated in "CHINA SSL".

Apr. 2012

Participated in "Green Lighting Shanghai 2012".

May 2012

Technovision | Semiconductor Manufacturing, Cleaning System, Post-process

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