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■Wafer container and carrier cleaning systems
Cassette Cleaning System: Well suited to small-lot production,
R&D, and high-end devices
■Photomask Cleaning System
System for large-sized photomasks:
For PDPs and large masks
System for medium-sized photomasks:
Supports up to 620×720 mm
System for small-sized photomasks:
Supports up to 460×360 mm or 300×300 mm
■Mask Cleaning System
TWC-300 Mask Cleaning System
■UV Ozone Cleaning System
Model UV-208: For use with exposure areas of 208×208 mm
Model UV-312: For use with exposure areas of 312×312 mm
■Super Clean Heater
QH series for ultra-pure DI water heating (inline type)
SH series for clean air heating (inline type)
■Wafer Mounter
Wafer mounter for dicing
For both pre-cut and normal tapes
For pre-cut tape only
For normal tape only
For DAF with dicing tape
Wafer mounter for DAF (Die-Attached Film)
For single DAF tape
For DAF with dicing tape
Functional tape lamination
Front-protection tape/BG tape
Rear-protection tape
Resist film
Lamination of other films and tapes
Multi-purpose lamination
Package boards, glass, ceramic, and others
Twin tape mounter (two rolls of film can be set to one mounter)
■Die Matrix Expander
Model TEX-21B: For up to 125 mm (5") wafers
Model TEX-218: For up to 150 - 200 mm (6 - 8") wafers
■UV Curing System
LED light source model
High-pressure Hg lamp model (high-power type)
Black light model
■Assembly Aid
Grip Ring
Bidirectional grip rings that can be applied in either direction
are available in four sizes.
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